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PRODUCTPREVIEW
TPS65910, TPS659101, TPS659102, TPS659103
TPS659104, TPS659105, TPS659106, TPS659107, TPS659108, TPS659109
www.ti.com
SWCS046C –MARCH 2010–REVISED JUNE 2010
Integrated Power Management Unit Top Specification
Check for
Samples: TPS65910, TPS659101, TPS659102, TPS659103, TPS659104, TPS659105, TPS659106, TPS659107, TPS659108, TPS659109
1
FEATURES APPLICATIONS
• Portable and handheld systems
The purpose of the TPS65910 device is to
provide the following resources:
• OMAP3 power management
• Embedded power controller
DESCRIPTION
• Two efficient step-down dc-dc converters for
processor cores
The TPS65910 is an integrated power-management
IC available in 48-QFN package and dedicated to
• One efficient step-down dc-dc converter for I/O
applications powered by one Li-Ion or Li-Ion polymer
power
battery cell or 3-series Ni-MH cells, or by a 5-V input;
• One efficient step-up 5-V dc-dc converter
it requires multiple power rails. The device provides
• SmartReflex™ compliant dynamic voltage
three step-down converters, one step-up converter,
and eight LDOs and is designed to support the
management for processor cores
specific power requirements of OMAP-based
• 8 LDO voltage regulators and one RTC LDO
applications.
(internal purpose)
Two of the step-down converters provide power for
• One high-speed I
2
C interface for
dual processor cores and are controllable by a
general-purpose control commands (CTL-I
2
C)
dedicated class-3 SmartReflex interface for optimum
• One high-speed I
2
C interface for SmartReflex
power savings. The third converter provides power for
Class 3 control and command (SR-I
2
C)
the I/Os and memory in the system.
• Two enable signals multiplexed with SR-I
2
C,
The device includes eight general-purpose LDOs
configurable to control any supply state and
providing a wide range of voltage and current
processor cores supply voltage
capabilities; they are fully controllable by the I
2
C
• Thermal shutdown protection and hot-die
interface. The use of the LDOs is flexible; they are
intended to be used as follows: Two LDOs are
detection
designated to power the PLL and video DAC supply
• A real-time clock (RTC) resource with:
rails on the OMAP based processors, four
– Oscillator for 32.768-kHz crystal or 32-kHz
general-purpose auxiliary LDOs are available to
built-in RC oscillator
provide power to other devices in the system, and
two LDOs are provided to power DDR memory
– Date, time and calendar
supplies in applications requiring these memories.
– Alarm capability
In addition to the power resources, the device
• One configurable GPIO
contains an embedded power controller (EPC) to
• DC-DC switching synchronization through
manage the power sequencing requirements of the
internal or external 3-MHz clock
OMAP systems and an (RTC).
Figure 1 shows the top-level diagram of the device.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCT PREVIEW information concerns products in the
Copyright © 2010, Texas Instruments Incorporated
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
www.BDTIC.com/TI
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