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Corcom Product Guide
LCT Series
250
LCT Series
Dimensions are in inches and millimeters unless otherwise specified. Values in italics
are metric equivalents. Dimensions are shown for reference purposes only.
Specifications subject to change.
Catalog: 1654001
Issue Date: 06.2011
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Low Capacitance Modular RJ Jacks
Specifications
• Low capacitance model for improved
performance.
• Particularly suited for ethernet applications
• Available with block or sleeve inductance
• Available with board grounded shield or
spring fingered panel ground interface
Available Part Numbers
UL Recognized
CSA Certified
RJ11-6LCT1-S RJ45-8LCT1-S
RJ11-6LCT1-B RJ45-8LCT1-B
RJ11-6LCT2-S RJ45-8LCT2-S
RJ11-6LCT2-B RJ45-8LCT2-B
Typical Insertion Loss
Performance Data
Model dimensions and PC board layout on pages 255-259
Shield 2
RJ11
Shield 1
RJ11
Shield 2
RJ45
Shield 1
RJ45
Contacts:
Material: Phosphor Bronze
Plating: 50 microinches gold
Barrier underplating: 100 microinches nickel
Resistance:
Initial: 20 m max.
After 500 mating cycles: 30 m max.
Capacitors:
Type: Monolithic ceramic chip
Standard Value: 82 pF
Standard Tolerance: ± 20%
Ferrites:
Type: High resistivity, nickel zinc ceramic
S
leeve
s: Single-aperture cylinders
Block: Multi-aperture rectangular prism
Shield Material: Tin-plated copper alloy
Housing Material: Glass-filled polyester (UL94V-0)
Dielectric Withstanding Voltage:
Line to Line and Line to Ground: 1000 VAC for
60 seconds
Printed Circuit Board Retention:
Before soldering: 1 lb. minimum
After soldering: 20 lb. minimum
