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OMAP3515, OMAP3503
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SPRS505H –FEBRUARY 2008–REVISED OCTOBER 2013
OMAP3515 and OMAP3503 Applications Processors
Check for Samples: OMAP3515, OMAP3503
1 OMAP3515 and OMAP3503 Applications Processors
1.1 Features
12
– 256-KB L2 Cache
• OMAP3515 and OMAP3503 Devices:
• 112KB of ROM
– OMAP™ 3 Architecture
• 64KB of Shared SRAM
– MPU Subsystem
• Endianess:
• Up to 720-MHz ARM® Cortex™-A8 Core
– ARM Instructions – Little Endian
• NEON™ SIMD Coprocessor
– ARM Data – Configurable
– PowerVR® SGX™ Graphics Accelerator
(OMAP3515 Device Only) • External Memory Interfaces:
• Tile-Based Architecture Delivering up to – SDRAM Controller (SDRC)
10 MPoly/sec
• 16- and 32-Bit Memory Controller with
• Universal Scalable Shader Engine: Multi- 1GB of Total Address Space
threaded Engine Incorporating Pixel and
• Interfaces to Low-Power Double Data
Vertex Shader Functionality
Rate (LPDDR) SDRAM
• Industry Standard API Support:
• SDRAM Memory Scheduler (SMS) and
OpenGLES 1.1 and 2.0, OpenVG1.0
Rotation Engine
• Fine-Grained Task Switching, Load
– General Purpose Memory Controller (GPMC)
Balancing, and Power Management
• 16-Bit-Wide Multiplexed Address and
• Programmable High-Quality Image Anti-
Data Bus
Aliasing
• Up to 8 Chip-Select Pins with 128-MB
– Fully Software-Compatible with ARM9™
Address Space per Chip-Select Pin
– Commercial and Extended Temperature
• Glueless Interface to NOR Flash, NAND
Grades
Flash (with ECC Hamming Code
• ARM Cortex-A8 Core Calculation), SRAM, and Pseudo-SRAM
– ARMv7 Architecture • Flexible Asynchronous Protocol Control
for Interface to Custom Logic (FPGA,
• TrustZone®
CPLD, ASICs, and so forth)
• Thumb®-2
• Nonmultiplexed Address and Data Mode
• MMU Enhancements
(Limited 2-KB Address Space)
– In-Order, Dual-Issue, Superscalar
• System Direct Memory Access (sDMA)
Microprocessor Core
Controller (32 Logical Channels with
– NEON Multimedia Architecture
Configurable Priority)
– Over 2x Performance of ARMv6 SIMD
• Camera Image Signal Processor (ISP)
– Supports Both Integer and Floating-Point
– CCD and CMOS Imager Interface
SIMD
– Memory Data Input
– Jazelle® RCT Execution Environment
– BT.601 (8-Bit) and BT.656 (10-Bit) Digital
Architecture
YCbCr 4:2:2 Interface
– Dynamic Branch Prediction with Branch
– Glueless Interface to Common Video
Target Address Cache, Global History
Decoders
Buffer, and 8-Entry Return Stack
– Resize Engine
– Embedded Trace Macrocell (ETM) Support
• Resize Images From 1/4x to 4x
for Noninvasive Debug
• Separate Horizontal and Vertical Control
• ARM Cortex-A8 Memory Architecture:
• Display Subsystem
– 16-KB Instruction Cache (4-Way Set-
Associative) – Parallel Digital Output
– 16-KB Data Cache (4-Way Set-Associative) • Up to 24-Bit RGB
1
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to
Copyright © 2008–2013, Texas Instruments Incorporated
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
Verzeichnis
- ・ Konfiguration des Pinbelegungsdiagramms on Seite 5 Seite 13
- ・ Abmessungen des Paketumrisses on Seite 258
- ・ Markierungsinformationen on Seite 258 Seite 259
- ・ Blockdiagramm on Seite 4 Seite 176 Seite 177 Seite 178
- ・ Beschreibung der Funktionen on Seite 195
- ・ Technische Daten on Seite 3 Seite 120 Seite 133 Seite 134 Seite 135
- ・ Anwendungsbereich on Seite 1 Seite 2 Seite 3 Seite 4 Seite 5
- ・ Elektrische Spezifikation on Seite 3 Seite 118 Seite 119 Seite 120 Seite 121
