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© Semiconductor Components Industries, LLC, 2016
August, 2016 − Rev. 8
1 Publication Order Number:
MC100EP16VB/D
MC100EP16VB
3.3V / 5V ECL Differential
Receiver/Driver with High
and Low Gain
Description
The EP16VB is a world-class differential receiver/driver. The
device is functionally equivalent to the EP16 and LVEP16 devices but
with both high and low gain outputs. Q
HG
and Q
HG
outputs have a DC
gain several times larger than the DC gain of an EP16. Q
output is
provided for feedback purposes.
The V
BB
pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to V
BB
as a switching reference voltage.
V
BB
may also rebias AC coupled inputs. When used, decouple V
BB
and V
CC
via a 0.01ĂmF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, V
BB
should be left open.
Special considerations are required for differential inputs under No
Signal conditions to prevent instability.
The 100 Series contains temperature compensation.
Features
• Gain = > 200
• Maximum Frequency = > 3 GHz Typical
• PECL Mode Operating Range:
V
CC
= 3.0 V to 5.5 V with V
EE
= 0 V
• NECL Mode Operating Range:
V
CC
= 0 V with V
EE
= −3.0 V to −5.5 V
• V
BB
Output
• These Devices are Pb-Free, Halogen Free and are RoHS Compliant
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
M = Date Code
G = Pb-Free Package
SOIC−8 NB
D SUFFIX
CASE 751−07
MARKING DIAGRAMS*
TSSOP−8
DT SUFFIX
CASE 948R−02
ALYWG
G
KP65
1
8
1
8
www.onsemi.com
*For additional marking information, refer to
Application Note AND8002/D
.
1
8
KEP65
ALYW
G
1
8
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping†
MC100EP16VBDG SOIC−8 NB
(Pb-Free)
98 Units / Tube
MC100EP16VBDR2G
2500 Tape & Reel
TSSOP−8
(Pb-Free)
MC100EP16VBDTR2G 2500 Tape & Reel
MC100EP16VBDTG 100 Units / Tube
SOIC−8 NB
(Pb-Free)
TSSOP−8
(Pb-Free)
†For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D
.
SOIC−8 NB TSSOP−8
Verzeichnis
- ・ Konfiguration des Pinbelegungsdiagramms on Seite 2
- ・ Abmessungen des Paketumrisses on Seite 7 Seite 8
- ・ Paket-Footprint-Pad-Layout on Seite 7
- ・ Teilenummerierungssystem on Seite 1 Seite 8
- ・ Markierungsinformationen on Seite 1 Seite 6 Seite 8
- ・ Typisches Anwendungsschaltbild on Seite 2
- ・ Technische Daten on Seite 1
- ・ Teilenummernliste on Seite 3