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SZBZX84C10ET1G Anwendungshinweis - ON Semiconductor

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SZBZX84C10ET1G Anwendungshinweis

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© Semiconductor Components Industries, LLC, 2003
October, 2016 Rev. 10
1 Publication Order Number:
BZX84C2V4ET1/D
BZX84CxxxET1G Series,
SZBZX84CxxxET1G Series
Zener Voltage Regulators
250 mW SOT23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Specification Features
250 mW Rating on FR4 or FR5 Board
Zener Breakdown Voltage Range 2.4 V to 75 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Peak Power 225 W (8 X 20 ms)
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
These Devices are PbFree and are RoHS Compliant
Mechanical Characteristics
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V0
MAXIMUM RATINGS
Rating Symbol Max Unit
Peak Power Dissipation @ 20 ms (Note 1)
@ T
L
25°C
P
pk
225 W
Total Power Dissipation on FR5 Board,
(Note 2) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance, JunctiontoAmbient
P
D
R
q
JA
250
2.0
500
mW
mW/°C
°C/W
Total Power Dissipation on Alumina
Substrate, (Note 3) @ T
A
= 25°C
Derated above 25°C
Thermal Resistance, JunctiontoAmbient
P
D
R
q
JA
300
2.4
417
mW
mW/°C
°C/W
Junction and Storage Temperature Range T
J
, T
stg
65 to
+150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Nonrepetitive current pulse per Figure 9.
2. FR5 = 1.0 X 0.75 X 0.62 in.
3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.
Device Package Shipping
ORDERING INFORMATION
SOT23
CASE 318
STYLE 8
3
Cathode
1
Anode
MARKING DIAGRAM
www.onsemi.com
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
DEVICE MARKING INFORMATION
BZX84CxxxET1G SOT23
(PbFree)
3,000 /
Tape & Reel
1
xxx M G
G
BZX84CxxxET3G SOT23
(PbFree)
10,000 /
Tape & Reel
xxx = Device Code
M = Date Code*
G = PbFree Package
*Date Code orientation may vary depending up-
on manufacturing location.
(Note: Microdot may be in either location)
SZBZX84CxxxET1G SOT23
(PbFree)
3,000 /
Tape & Reel
SZBZX84CxxxET3G SOT23
(PbFree)
10,000 /
Tape & Reel
Verzeichnis

SZBZX84C10ET1G Datenblatt-PDF

SZBZX84C10ET1G Datenblatt PDF
ON Semiconductor
6 Seiten, 82 KB
SZBZX84C10ET1G Anderes Datenblatt
ON Semiconductor
7 Seiten, 172 KB
SZBZX84C10ET1G Anwendungshinweis
ON Semiconductor
6 Seiten, 167 KB

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