Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC5645S
Rev. 12, 10/2014
© Freescale Semiconductor, Inc., 2009–2014. All rights reserved.
MPC5645S
416 TEPBGA
27 mm × 27 mm
176 LQFP
24 mm × 24 mm
208 LQFP
28 mm × 28 mm
The Qorivva MPC5645S represents a new generation of
32-bit microcontrollers targeting single-chip automotive
instrument cluster applications. MPC5645S devices are part
of the MPC56xxS family of Power Architecture
®
-based
devices. This family has been designed with an emphasis on
providing cost-effective and high quality graphics capabilities
in order to satisfy the increasing market demand for color
Thin Film Transistor (TFT) displays within the vehicle
cockpit. Traditional cluster functions, such as gauge drive,
real time counter, and sound generation are also integrated on
each device.
Devices in the MPC56xxS family contain between 256 KB
and 2 MB internal flash memory. The family allows for easy
expansion and covers a broad range of cluster applications
from low to high-end enabling users to design a complete
platform around one common architecture. Serial flash
memory and DRAM interfaces are provided to allow even
greater system flexibility.
The MPC5645S is designed to reduce development and
production costs of TFT-based instrument cluster displays by
providing a single-chip solution with the processing and
storage capacity to host and execute real-time application
software and drive TFT displays directly.
The MPC5645S features a 2D OpenVG graphics accelerator,
Video Input Unit (VIU2) and two on-chip display control
units (DCU3 and DCULite) designed to drive two color TFT
displays simultaneously. The MPC5645S includes an
enhanced QuadSPI Serial Flash Controller and an optional
DRAM controller allowing graphics RAM expansion
externally.
The MPC5645S is compatible with the existing development
infrastructure of current Power Architecture devices and are
supported with software drivers, operating systems and
configuration code to assist with application development.
Qorivva MPC5645S
Microcontroller Data Sheet
1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.1 Device comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.3 Feature list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
1.4 Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
2 Pinout and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . 24
2.1 176 LQFP package pinout . . . . . . . . . . . . . . . . . . . . . .24
2.2 208 LQFP package pinout . . . . . . . . . . . . . . . . . . . . . .25
2.3 416 TEPBGA package pinout. . . . . . . . . . . . . . . . . . . . 26
2.4 Signal description. . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
3 System design information. . . . . . . . . . . . . . . . . . . . . . . . . . .59
3.1 Power-up sequencing. . . . . . . . . . . . . . . . . . . . . . . . . . 59
4 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4.2 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . 60
4.3 Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . .60
4.4 Recommended operating conditions . . . . . . . . . . . . . . 62
4.5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 64
4.6 EMI (electromagnetic interference) characteristics . . .69
4.7 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
4.8 DC electrical specifications. . . . . . . . . . . . . . . . . . . . . . 74
4.9 SSD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
4.10 RESET
electrical characteristics . . . . . . . . . . . . . . . . .84
4.11 Fast external crystal oscillator (4–16 MHz) electrical
characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
4.12 Slow external crystal oscillator (32 KHz) electrical
characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
4.13 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . .89
4.14 Fast internal RC oscillator (16 MHz) electrical
characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
4.15 Slow internal RC oscillator (128 kHz) electrical
characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
4.16 Flash memory electrical characteristics . . . . . . . . . . . . 91
4.17 ADC parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
4.18 AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
4.19 AC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . 134
5.1 176 LQFP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
5.2 208 LQFP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
5.3 416 TEPBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
