herunterladen
![](https://oss-datasheet.aipcba.com/html/962CCAACE12EC727A56CA2637FBCFE4D/bg1.png)
AN10343
MicroPak soldering information
Rev. 2 — 30 December 2010 Application note
Document information
Info Content
Keywords MicroPak, footprint, Ball Grid Array (BGA), Wafer-Level Chip Scale
Package (WLCSP)
Abstract This application note describes evaluation of recommended solder land
patterns for mounting MicroPak packages
Verzeichnis