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AN11046
Recommendations for PCB assembly of DSN0603-2
Rev. 3 — 30 September 2016 Application note
Document information
Info Content
Keywords DSN0603, DSN0603-2, SOD962, 0603 package size, reflow soldering,
surface mount, solder paste, stencil aperture, Printed-Circuit Board (PCB),
Solder Mask Defined (SMD), footprint, landing pattern, pick and place,
Chip-Scale Package (CSP)
Abstract This application note provides guidelines for board assembly of the
ultra-small DSN0603-2 (0.6 0.3 mm
2
) chip-scale package. The main
focus is on recommendations for reflow soldering.
For general information about footprint design and reflow soldering, see
application note AN10365 (Surface mount reflow soldering description).
If not otherwise stated, all measurement units given in this document are
metric units. This means that also the package nomenclature (for example
the term "0603") refers to metric units.
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