NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6SLLCEC
Rev. 0, 04/2017
Ordering Information
See Table 1 on page 2
© 2017 NXP B.V.
MCIMX6V7DVN10AB
Package Information
Plastic Package
13 x 13 mm, 0.5 mm pitch BGA
1 Introduction
The i.MX 6SLL processor represents NXP’s latest
achievement in integrated multimedia applications
processors, which are part of a growing family of
multimedia-focused products that offer high
performance processing and are optimized for lowest
power consumption.
The processor features NXP’s advanced implementation
of a single ARM
®
Cortex
®
-A9, which operates at speeds
up to 1 GHz. The processor provides a 32-bit DDR
interface that supports LPDDR2 and LPDDR3. In
addition, there are a number of other interfaces for
connecting peripherals, such as WLAN, Bluetooth™,
GPS, hard drive, displays, and camera sensors.
The i.MX 6SLL processor is specifically useful for
applications, such as:
• Color and monochrome eReaders
• Barcode scanners
• Connectivity
• IoT devices
i.MX 6SLL Applications
Processors for Consumer
Products
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 11
3.2. Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 15
4.2. Power Supplies Requirements and Restrictions . 23
4.3. Integrated LDO Voltage Regulator Parameters . . 24
4.4. PLL’s Electrical Characteristics . . . . . . . . . . . . . . . 25
4.5. On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . 26
4.6. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 27
4.7. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 31
4.8. Output Buffer Impedance Parameters . . . . . . . . . 33
4.9. System Modules Timing . . . . . . . . . . . . . . . . . . . . 36
4.10. External Peripheral Interface Parameters . . . . . . . 39
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . . 65
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . . 65
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . . 66
6. Package Information and Contact Assignments . . . . . . 67
6.1. 13 x 13 mm Package Information . . . . . . . . . . . . . 67
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
