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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX53AEC
Rev. 7, 05/2015
MCIMX53xA
Package Information
Plastic Package
Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch
Ordering Information
See Table 2 on page 4
© 2011-2015 Freescale Semiconductor, Inc. All rights reserved.
1 Introduction
The MCIMX53xA (i.MX53xA) automotive
infotainment processor represents Freescale
Semiconductor’s advanced multimedia and
power-efficient implementation of the ARM
Cortex™-A8 core with a high degree of functional
integration, aimed at the growing automotive
infotainment, telematics, HMI, and display-based cluster
markets. This device includes 3D and 2D graphics
processors, 1080i/p video processing, and dual display,
and provides a variety of interfaces. The i.MX53xA
processor features ARM Cortex™-A8 core, which
operates at clock speeds as high as 800 MHz. It provides
DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800
DRAM memories. This device is well suited for graphics
rendering for HMI, navigation, high performance speech
processing with large databases, video processing and
display, audio playback, and many other applications.
The flexibility of the i.MX53xA architecture allows for
its use in a wide variety of applications. As the heart of
the application chipset, the i.MX53xA processor
i.MX53xA Automotive and
Infotainment Applications
Processors
Silicon Version 2.1
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Functional Part Differences and Ordering
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 18
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 18
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 18
4.2. Power Supply Requirements and Restrictions . . . 26
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 29
4.4. Output Buffer Impedance Characteristics . . . . . . 35
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 39
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 46
4.7. External Peripheral Interfaces Parameters . . . . . 68
4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 147
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 148
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 148
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 149
5.3. Power Setup During Boot . . . . . . . . . . . . . . . . . . 150
6. Package Information and Contact Assignments . . . . . 151
6.1. 19x19 mm Package Information . . . . . . . . . . . . . 151
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
