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MC34875 Anwendungshinweis - Multicomp

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MC34875 Anwendungshinweis

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Page <1> 23/06/09 V1.1
http://www.farnell.com
http://www.newark.com
http://www.cpc.co.uk
Nylon 6T Recommended Temperature Profile
Nylon 6T Material Temperature Specifications
Solder regular conditions:
Soldering temperature : 260°C ±5°C.
Time : 10 seconds ±3 seconds.
Minimum solder wetting percentage : 95%.
Multicomp test conditions:
1. Solder method : Reflow or wave-solderiger.
2. Environment : Room air.
3. Solder composition : Solding paste.
4. Test board : 52mm x 36.5mm x 1.6mm thick.
5. This temperature profile is based on the above conditions. In individual applications the actual temperature may vary.
Consult solder paste and equipment manufacturer for specific recommendations.
6. There must not be visible defect after testing.
Reflow Condition
Part Number Table
Description Part Number
Header, Right Angle, SMT, 2 Way 2261(5561)R-02T-SM1
Disclaimer This data sheet and its contents (the "Information") belong to the Premier Farnell Group (the "Group") or are licensed to it. No licence is granted for the use of it other than for information purposes
in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied.
The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data
sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage
resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded.
This will not operate to limit or restrict the Group's liability for death or personal injury resulting from its negligence. SPC Multicomp is the registered trademark of the Group. © Premier Farnell plc 2009.
Solderbility Profile
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