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CHIP DIODES
ESD1537
September, 2015
Change to Die Attach Material and Application Process for
Bourns® Model CD143A-SR05, CD143A-SR12 & CDSOT23-SRV05-4
TVS Diode Array Series
In order to support our fast growing demand, Bourns is making a change to the die attach material and its
application process for the Bourns® Model CD143A-SR05, CD143A-SR12 and CDSOT23-SRV05-4 TVS Diode
Array Series. is change will help improve the reproducibility of the adhesive llet. A conductive die attach lm
(CDAF) will be used in place of the current conductive epoxy. ere are no changes to the data sheet ratings or
electrical characteristics.
e change to the die attach material and its application process has no impact on the t, form or function of the
product. e product marking and label will remain unchanged.
Evaluation samples and quali cation data are available upon request. For clari cation, beginning April 1, 2016,
customers may receive products using the CDAF.
Implementation dates are as follows:
Date that manufacturing of existing product will cease: March 31, 2016
Bourns will begin phasing in this process: April 1, 2016
First date code using the above changes: 1613
If you have any questions or need additional information, please feel free to contact Customer Service/
Inside Sales.
